To provide a prepreg which assures heat resistance such as thermal decomposition temperature, adhesive force, and desired flame retardancy, and effectively prevents the lowering of glass transition temperature when an epoxy resin composition containing an epoxy resin including nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and an imidazole silane compound is used, and to provide a method for producing the same.
The prepreg is obtained by impregnating a base material with an epoxy resin composition, and then heating and drying the base material impregnated with the composition, and is characterized in that the content of volatile components is ≤0.7 mass%. The epoxy resin composition contains an epoxy resin including nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, an imidazole silane compound including an imidazol group and an alkoxy silyl group in the molecule, and a solvent, wherein the bromine content of the resin solid content is ≥10 mass%.
NAKAMURA YOSHIHIKO
IMAIZUMI EIJI
| JP2002145994A | 2002-05-22 | |||
| JP2003268137A | 2003-09-25 |
| WO2008102853A1 | 2008-08-28 | |||
| WO2008032383A1 | 2008-03-20 |
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