To provide a prepreg which can meet a demand for thickness reduction and which allows an amount of a resin composition to be set appropriately depending on a circuit pattern; and to provide a substrate and a semiconductor device having the prepreg.
The prepreg 10 has a fiber base material 1 comprising a glass fiber, a first resin layer 21 located on one side of the fiber base material 1, and a second resin layer 22 located on another side of the fiber base material 1. The first resin layer 21 and the second resin layer 22 have the same composition or different resin material 2, the thickness of the first resin layer 21 is thicker than that of the second resin layer 22. A thermal expansion coefficient of the prepreg 10 in a plane direction is 12 ppm or less.
| JP2005307088 | PREPREG AND LAMINATED SEAT |
| WO/2015/186597 | MOLDING MATERIAL FOR HEAT-COMPRESSION MOLDING, AND MOLDED ARTICLE OF SAME |
BABA TAKAYUKI
YUASA MADOKA
| JP2003340952A | 2003-12-02 | |||
| JPH1034649A | 1998-02-10 | |||
| JPH09202834A | 1997-08-05 | |||
| JPH07216111A | 1995-08-15 | |||
| JP2004277671A | 2004-10-07 |
| WO2004027136A1 | 2004-04-01 |
Kazuo Asahi
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