Title:
プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ
Document Type and Number:
Japanese Patent JP7243077
Kind Code:
B2
Abstract:
To provide a cured product of a prepreg which is excellent in low thermal expansion, and can obtain high peel strength even when surface roughness (Rz) of a metal foil of a metal-clad laminate is 1.4 μm or less, and a prepreg capable of obtaining the cured product.SOLUTION: A cured product of a prepreg contains a thermosetting resin composition containing siloxanediamine (a) represented by the following general formula (a-1) and a maleimide compound (b) having at least two N-substituted maleimide groups, in the thermosetting resin composition, the component (a) and the component (b) may exist in a state where at least a part of the components are reacted, the total amount of the unreacted component (a) and the reacted component (a) in the thermosetting resin composition is 2-20 mass%, and in the element composition constituting the surface of the cured product obtained by X-ray photoelectron spectroscopy analysis, an abundance ratio of a silicon element is 5.0% or less to the total of a carbon element, a nitrogen element, an oxygen element and the silicon element.SELECTED DRAWING: None
Inventors:
Toshiki Fujii
Application Number:
JP2018152068A
Publication Date:
March 22, 2023
Filing Date:
August 10, 2018
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C08J5/24; B32B15/08; H01L23/14; H05K1/03
Domestic Patent References:
| JP2017190460A |
Foreign References:
| WO2017191771A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office
Kenichi Hirasawa
Yosuke Sawayama
Kenichi Hirasawa
Yosuke Sawayama