Title:
感圧接着剤組成物およびその調製方法ならびにフレキシブル有機発光ダイオード用途での使用
Document Type and Number:
Japanese Patent JP7254065
Kind Code:
B2
Abstract:
A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective film is useful in flexible OLED device fabrication processes, e.g., for protection of passivation layers.
Inventors:
Chan, Wonpom
Kim, Pokyun
Han, Kyung Tong
Kim, Pokyun
Han, Kyung Tong
Application Number:
JP2020504715A
Publication Date:
April 07, 2023
Filing Date:
October 17, 2018
Export Citation:
Assignee:
Dow Silicones Corporation
International Classes:
C09J183/07; C09J7/38; C09J11/06; C09J183/04; C09J183/05; H05B33/02; H05B33/04; H05B33/10; H10K50/00
Domestic Patent References:
| JP2015160922A |
Foreign References:
| WO2016139956A1 | ||||
| WO2011024690A1 |
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe