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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPS5853970
Kind Code:
A
Abstract:

PURPOSE: The titled composition having improved adhesiveness and cohesive force without causing reduction in water resistance and problems of environmental hygiene, comprising a bulk material obtained by continuous bulk polymerization of an acrylic monomer a main component for adhesion.

CONSTITUTION: The titled composition comprising a bulk polymer having adhesivity at normal temperature as a main component for adhesive. The bulk polymer is obtained by polymerizing quickly a polymerization raw material having a viscosity of ≤10 poise at normal temperature, consisting essentially of an acrylic monomer, in the absence of a solvent which is used in a common solution polymerization, by a radical polymerization initiator in the former half zone of a transportation process, to increase the viscosity of a polymer, followed by polymerizing the polymer until it has a given conversion ratio. The polymerization is carried out in a reactor having a structure to transfer continuously successively fed contents with renewing the surface of the contents, wherein the whole zone of transportation process is controlled at a given temperature by heating.


Inventors:
SANO KENJI
MATSUOKA NAOKI
MATSUMOTO KEIJI
SAYANAGI SHIYUNICHIROU
NASU TAKESHI
Application Number:
JP15332681A
Publication Date:
March 30, 1983
Filing Date:
September 28, 1981
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO
International Classes:
C08F2/02; C08F20/00; C08F20/10; C09J133/04; (IPC1-7): C08F2/02; C09J3/14
Domestic Patent References:
JPS5557046A1980-04-26
Attorney, Agent or Firm:
Kunio Araimoto



 
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