Title:
PRESSURE-SENSITIVE ADHESIVE AND METHOD FOR USING THE SAME, AND PRESSURE-SENSITIVE ADHESIVE MATERIAL AND METHOD FOR USING THE SAME
Document Type and Number:
Japanese Patent JP2015199793
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive having excellent heat resistance and releasability even when exposed to a high temperature environment.SOLUTION: The pressure-sensitive adhesive comprises a condensation resin having a polyoxyalkanediyl group or a 1,4-piperazinediyl group, and a compound containing boron. The condensation resin comprises a structural unit obtained by condensation-polymerizing a polymerizable monomer comprising: at least one monomer (A) selected from a carboxylic acid having at least two carboxyl groups, an anhydride of the carboxylic acid, an ester of the carboxylic acid, and a halide of the carboxylic acid; and a monomer (B) having at least two amino groups. The monomer (B) comprises a monomer (b1) having a polyoxyalkanediyl group and at least two amino groups, and a monomer (b2) having a 1,4-piperazinediyl group and at least two amino groups.
Inventors:
SHINADA EIITSU
MASUDA KATSUYUKI
YAMAMOTO KAZUNORI
MASUDA KATSUYUKI
YAMAMOTO KAZUNORI
Application Number:
JP2014078066A
Publication Date:
November 12, 2015
Filing Date:
April 04, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C09J7/02; C09J11/04; C09J177/00; C09J201/02; C09J201/06
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Yoshinori Shimizu
Tomoya Furoshita
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