Title:
PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR SUBSTRATE PROCESSING
Document Type and Number:
Japanese Patent JP2004035644
Kind Code:
A
Abstract:
To provide a pressure-sensitive adhesive sheet which, when used in semiconductor substrate processing, causes less contamination of the substrate and exhibits excellent expandability and chipping resistance.
The pressure-sensitive adhesive sheet comprises a film support and a pressure-sensitive adhesive agent comprising a base polymer, a radiation-polymerizable compound, and a radiation polymerization initiator, wherein the film support is made from an acrylic resin and has a durometer hardness D as specified in JIS K7215 of 25-55.
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Inventors:
ODA NAOYA
TAKEDA YUKINORI
TAKEDA YUKINORI
Application Number:
JP2002191972A
Publication Date:
February 05, 2004
Filing Date:
July 01, 2002
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09J7/02; C09J4/00; C09J201/02; H01L21/301; (IPC1-7): C09J7/02; C09J4/00; C09J201/02; H01L21/301
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