Title:
Pressure sensitive adhesive sheet
Document Type and Number:
Japanese Patent JP5990657
Kind Code:
B2
Abstract:
Provided is a pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer formed of a multilayer structure of three or more layers including a fine particle-containing layer that contains fine particles in an amount of 15% by mass or more, at least a surface (±) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein the fine particle-containing layer is formed not as the outermost layer of the resin layer, and one or more concave portions exist on the surface (±) and the shapes of the one or more concave portions have irregular shapes. When attached to an adherend, the pressure sensitive adhesive sheet can exhibit excellent air escape property of readily removing air accumulation which may be formed, good blister resistance and good pressure sensitive adhesion characteristics.
Inventors:
Kazue Uemura
Koichiro Kato
Yumiko Amino
Saitou
Matsushima University
Koichiro Kato
Yumiko Amino
Saitou
Matsushima University
Application Number:
JP2015563011A
Publication Date:
September 14, 2016
Filing Date:
April 02, 2015
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/10; C09J11/04; C09J201/00
Domestic Patent References:
| JP2004115766A | 2004-04-15 | |||
| JP2012136717A | 2012-07-19 | |||
| JP2004115766A | 2004-04-15 | |||
| JP2012136717A | 2012-07-19 |
Attorney, Agent or Firm:
Tamotsu Otani
Makoto Kataoka
Makoto Kataoka