To provide a pressure-sensitive conductive film which can exhibit the conductivity of a predetermined value in the predetermined amount of compression before and after the addition of a high temperature, and also to provide a multilayer printed wiring board using the same film.

The pressure-sensitive conductive film 3 comprises a conductive filler 1 and a resin material 2. The conductive filler has an aspect ratio of 5 or more. The pressure-sensitive conductive film 3 is provided between a first substrate 6 and a second substrate 7 including terminals 61, 71 on the surfaces thereof. This film 3 is compressed in the thickness direction to attain electrical conductivity between the terminals 61 and 71 and close adhesion between the first substrate 6 and second substrate 7.