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Patent Searching and Data


Title:
PRESSURE-SENSITIVE FILMY ADHESIVE
Document Type and Number:
Japanese Patent JPH0431477
Kind Code:
A
Abstract:

PURPOSE: To improve resistance to repulsion and maintenance of heat resistance by providing a pressure-sensitive adhesive layer, which comprises a crosslinked structure divided into a plurality of blocks in the direction of the base surface, on the surface of a (non)peelable film base.

CONSTITUTION: A pressure-sensitive adhesive comprising a solvent-based or (non)aqueous emulsion containing a crosslinking agent is applied to the surface of a (non)peelable film base 5-100μm thick in such a manner that it may have striped, network, dotted or other patterns 2-200μm thick and each block has a mirror axis diameter below 10 times the thickness. Then, the adhesive is crosslinked at room temp. or with heating so as to divide the adhesive layer in a plurality of blocks.


Inventors:
SATSUMA MICHIO
Application Number:
JP13563190A
Publication Date:
February 03, 1992
Filing Date:
May 25, 1990
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; C09J201/00; (IPC1-7): C09J7/02
Attorney, Agent or Firm:
Kunio Araimoto