To provide a pressure sensor module having excellent precision by being normally operated over a temperature range of ≤60°C and ≥-50°C.

The pressure sensor module includes: a ceramic substrate 24 providing a pressure guide hole 36 and having a thermal expansion coefficient of ≤10×10-6; a semiconductor pressure sensor chip 28 bonded with an adhesive 34 holding elasticity on the ceramic substrate opening the pressure guide hole even at ≤-40°C and for being normally operated even at ≤-40°C; an electrical circuit 30 mounted on the ceramic substrate and for amplifying output voltage of the semiconductor pressure sensor chip; and capacitors 32a, 32b for forming a wiring pattern of a material of less change of electrical characteristics on the ceramic substrate even at ≤-40°C and for noise removal being normally operated on the wiring pattern even at ≤-40°C.

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