Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2002082009
Kind Code:
A
Abstract:
To provide an adequately miniaturizable structure in a pressure sensor in which a stem having a lead for taking a signal on one surface side and a sensor chip having a diaphragm for detecting pressure on one surface side are provided, and the sensor chip is mounted on one side of the stem with the sensor chip electrically connected to the lead.
A conductive bump 8 is formed on one surface 4a of the sensor chip 4, and the bump 8 is electrically connected to the lead 2 by thermo compression bonding or the like while the surface 4a of the sensor chip 4 is faced to one surface 1a of the stem 1.
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Inventors:
TAKI TAKAFUMI
NIDAN AKIRA
HARA HIDEAKI
MASUDA MICHIHIRO
BAN KANAME
TANAKA KAZUO
MURAKAMI YOSHIFUMI
NIDAN AKIRA
HARA HIDEAKI
MASUDA MICHIHIRO
BAN KANAME
TANAKA KAZUO
MURAKAMI YOSHIFUMI
Application Number:
JP2001010682A
Publication Date:
March 22, 2002
Filing Date:
January 18, 2001
Export Citation:
Assignee:
DENSO CORP
International Classes:
G01L9/04; G01L9/00; H01L29/84; (IPC1-7): G01L9/04; H01L29/84
Attorney, Agent or Firm:
Yoji Ito (2 outside)