Title:
圧力センサ
Document Type and Number:
Japanese Patent JP6621854
Kind Code:
B2
Abstract:
The purpose of the present invention is to: make it possible to achieve uniform adhesive layer (125A) thickness in a pressure sensor (100) using a piezoresistive-effect or other such semiconductor pressure sensor chip (126) through component-shape and processing-precision management; reduce, compared to the prior art, distortion of the semiconductor pressure sensor chip (126) resulting from temperature variation and differences in the linear expansion coefficients of, for example, the semiconductor pressure sensor chip (126), a support member, and an adhesive; and enhance sensor output accuracy. A pressure sensor (100) according to the present invention has, formed at a surface of a pillar (125) opposing a semiconductor pressure sensor chip (126), an intra-groove protrusion (125a) that is a flat protrusion formed at the center of the surface and a sensor chip support part (125c) that is an annular protrusion formed on the periphery of the pillar (125) such that a groove (125b) is disposed between the same and the intra-groove protrusion (125a). The thickness of an adhesive layer (125A) is determined according to the gap Δg between the intra-groove protrusion (125a) and the sensor chip support part (125c) touching the semiconductor pressure sensor chip (126).
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Inventors:
Kazuya Takimoto
Application Number:
JP2018014652A
Publication Date:
December 18, 2019
Filing Date:
January 31, 2018
Export Citation:
Assignee:
Saginomiya Co., Ltd.
International Classes:
G01L9/00; G01L19/06; G01L19/14
Domestic Patent References:
| JP2002350260A | ||||
| JP6462682B2 | ||||
| JP201448072A |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office