To provide a print head which employs a light emitting element substrate obtained by cutting a connecting piece in an assembled printed wiring board and yet prevents powder generated from the cutting plane from infiltrating into the print head.
The light emitting element substrate 5 in the print head 1 is obtained by fixing light emitting elements 4 on the assembled printed wiring board 41 in which a plurality of printed wiring boards 9 are connected with a plurality of connecting pieces 44 and by cutting off the plurality of connecting pieces 44. Otherwise, it is obtained by cutting off the plurality of connecting pieces 44 in the assembled printed wiring board 41 in which the plurality of printed wiring boards 9 are connected with the plurality of connecting pieces 44 and by fixing the light emitting elements 4. A sealing material 33 is applied to the cutting plane 42 of the plurality of connecting pieces 44 in the light emitting element substrates 5.
| JPH03135052A | 1991-06-10 | |||
| JPH11266037A | 1999-09-28 | |||
| JP2007095325A | 2007-04-12 | |||
| JP2009283959A | 2009-12-03 | |||
| JP2007095325A | 2007-04-12 | |||
| JP2009283959A | 2009-12-03 |
Kato Kazunori
Hiroshi Fukuda