To enhance the reliability of the connection in thermocompression bonding by a method wherein pads for bonding the terminals of an electronic component are provided on a component mounting layer, and painted-over patterns for equally dispersing a load in bonding the electronic component to the printed board are provided on the parts, which correspond to the pads, of wiring layers.

A multilayer printed board is constituted into a structure, wherein connection terminals 2 under the lower part of an electronic component 1 and connection terminal pads 5 on a component mounting layer 9 on a multilayer printed board 6 are thermally connected with each other via anisotropic conductive bonding particles 4 is an anisotropic conductive bonding agent 3 and solid pattern 8, which are painted- out patterns, are provided on the peripheries of wiring patterns 7, which are located directly under the pads 5, in wiring layers 10 and 11. Thereby, even if a load is applied to the layers 10 and 11 is a state that a resin of the board 6 is softened by heat in thermocompression bonding of the component 1 to the board 6, the load is equally dispersed and the connection of the terminals 2 under the lower part of the component 1 with the terminals 5 is stabilized.