To provide a printed board capable of preventing the generation of a bridge by continuously forming a solder reservoir land to a soldering land and collecting excess solder in the solder reservoir land.

In the printed board 1, in which a plurality of inserting holes 5..., into which lead wires 4... for a component 3 are inserted, are formed while being penetrated to upper and lower surfaces, soldering lands 6... for soldering to the peripheries of the opening sections of the above-mentioned inserting holes 5... in the conductor sections 2 of the board 1 are formed, solder reservoir lands 7... are formed continuously to at least either one sides of the soldering lands 6..., and virtual straight lines X tying the solder reservoir lands 7 and the inserting holes 5 are formed at the angle of inclination at approximately 45° to a board dip direction P from a board plane.