Title:
研磨材を中に有する印刷された化学機械研磨パッド
Document Type and Number:
Japanese Patent JP6953562
Kind Code:
B2
Abstract:
A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A plurality of layers of the particles is successively deposited according to the desired distribution with the 3D printer. The polymer matrix precursor is solidified into a polymer matrix having the particles embedded in the desired distribution.
Inventors:
Krishnan Casillaman
Patty Bandra Nag Bee
Goparam Periya
Patty Bandra Nag Bee
Goparam Periya
Application Number:
JP2020003819A
Publication Date:
October 27, 2021
Filing Date:
January 14, 2020
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B24D11/00; B24B37/22; B24B37/24; B24D3/00; B29C64/112; B33Y10/00; B33Y80/00; H01L21/304
Domestic Patent References:
| JP2008531306A | ||||
| JP2003071729A | ||||
| JP2007073796A | ||||
| JP2013089767A | ||||
| JP2012182314A | ||||
| JP2002028849A | ||||
| JP2002264025A |
Foreign References:
| WO2013162856A1 | ||||
| US5792544 |
Attorney, Agent or Firm:
Shinichiro Tanaka
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroshi Uesugi
Naoki Kondo
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroshi Uesugi
Naoki Kondo