To reduce an increase in manufacturing cost by performing reflow soldering at the upper surface side and additionally soldering the tip of a leg to the lower surface of a printed circuit board separately from the reflow soldering at the lower surface side.
The printed circuit board is provided in which the bonding strength of a connector 3 and the printed circuit board is increased by providing the connector with a leg 64 for bonding reinforcements, providing the printed circuit board 5 with a leg insertion hole, inserting the leg to the leg insertion hole and soldering the tip of the leg at the lower surface side of the printed circuit board, wherein the connector 3 is reflow-soldered to the upper surface of the printed circuit board 5, the connector 3 is provided with the leg 64 for bonding reinforcements, and the printed circuit board 5 has the leg insertion hole for inserting the leg 64. The leg 64 is inserted into the leg insertion hole, a part of reflow solder 71 is led to the lower surface side of the printed circuit board, and the tip of the leg 64 for bonding reinforcements is soldered to the lower surface 68 of the printed circuit board.
IMAI MIKITO
NIWA MAKIO
NAKAMICHI YUJI
Hitoshi Ito
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