PURPOSE: To provide a printed circuit board having bump electrode and a bonding method therefor, which can deal with bonding of a semiconductor device, a printer, a memory device, dielectric parts, circuit parts, and an inspection device, and can also deal with thinning of a printed circuit board at the time of surface mounting.

CONSTITUTION: A bump electrode 4 composed of a metallic material is formed on the end face side of a conductive circuit 2 of a printed circuit substrate, which is formed on one side or both sides of an insulating substrate 1. As a result, the circuit board can be connected to the electrode section 6 of an adherent 5. Moreover, insulating reliability is improved by covering the conductive circuit 2 with a dielectric layer 3 upon requirements.