PURPOSE: To dispense with an exclusive mold and to achieve cost reduction, in forming a seal resin part for protecting electronic parts on the other surface side of the base material of the printed wiring board for a long IC card, by bonding and fixing a seal resin flow preventing frame by a pad printing method.
CONSTITUTION: A substrate 1 for an IC card is constituted of a base material 11, the electronic part housing part (base material through-hole) 13 provided to the base material 11, a plurality of bonding holes 14 provided to the periphery of the electronic part housing part 13 and the contact terminals 15 formed on one surface (contact surface) 11b of the base material 11. In this case, from the necessity for performing resin sealing in forming the seal resin part protecting the electronic parts received in the housing part 13 on the side of the bonding surface 11a of the base material 11, a seal resin flow preventing frame 12 is formed on the surface surrounding the resin seal region. By this frame 12, the seal resin part is formed by a pad printing method using silicone type ink (silicone adhesive) and resin flow is effectively prevented.
ADACHI TAKEMA
HORIBA YASUHIRO
KIMATA KENRO
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