Title:
PRINTED-CIRCUIT BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0669402
Kind Code:
A
Abstract:
PURPOSE: To form a novel structure substrate by a method wherein a substrate includes an inside substrate and an outside substrate, and metal members are mutually electrically isolated and are protruded from the substrate and include an internal connection part formed integrally with a lead wire, and further electrical connection between the inside and outside substrates is achieved through a small wire piece brazed to a through-hole. CONSTITUTION: The present printed board is covered with a standard solder mask 20 to prevent shorcircuitting from being produced in a lead frame. Copper in each printed board is etched to form a metal circuit pattern 25 and is plated with gold. A lead frame 30 is manufactured by blanking and so on and includes a short solder tub previously bent and inserted through a clearance hole in a prepreg 50. A plated substrate connection hole 60 is aligned on a solder tub 40. Then, the whole assembly is inserted into a press for laminating the prepreg and a lead frame together. The solder tub 40 is brazed with the connection hole 60 with a proper solder.
Inventors:
MARUBUIN RANBAADO
Application Number:
JP12539993A
Publication Date:
March 11, 1994
Filing Date:
April 28, 1993
Export Citation:
Assignee:
SIEMENS COMP INC
International Classes:
H01L23/12; H01L23/495; H01L23/498; H01L23/50; H01L25/065; H01L25/16; H05K3/40; H05K3/46; (IPC1-7): H01L23/50; H01L23/12; H05K3/46
Attorney, Agent or Firm:
Tomimura Kiyoshi
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