Title:
プリント回路基板の製造方法
Document Type and Number:
Japanese Patent JP7286608
Kind Code:
B2
Abstract:
To provide a manufacturing method of a printed circuit board that can suppress the generation of solder balls when soldering is performed by reflow processing.SOLUTION: A manufacturing method of a printed circuit board according to the present invention includes a step of providing a step portion 24 such that a specific electronic component 1 can be mounted on the peripheral edge of a printed wiring board 2 on which the electronic component 1 is mounted so as to satisfy a condition expressed by the following mathematical formula (F1) before a step of mounting the electronic component 1: 0.5X≤Y≤1.5X (F1). X: The distance in the vertical direction between a grounding point of a lead wire 12 and the lower surface of the component body 11 when the component body 11 of the electronic component 1 is arranged horizontally. Y: The distance between the contact point between the lower surface of the component body 11 of the electronic component 1 and the step portion 24 and the surface of the land 22 in the vertical direction when the electronic component 1 is mounted on a land 22 of the printed wiring board 2.SELECTED DRAWING: Figure 4
Inventors:
Hitoshi Yamaguchi
Mitsuru Iwabuchi
Mitsuru Iwabuchi
Application Number:
JP2020198790A
Publication Date:
June 05, 2023
Filing Date:
November 30, 2020
Export Citation:
Assignee:
Tamura Manufacturing Co., Ltd.
International Classes:
H05K3/34
Domestic Patent References:
| JP2007012850A | ||||
| JP5235532A | ||||
| JP2016001717A | ||||
| JP8274444A |
Attorney, Agent or Firm:
Patent Attorney Corporation Kinoshita Intellectual Property Office
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