Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2014175655
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board, and more specifically a printed circuit board having insulating layer crack preventing part.SOLUTION: A printed circuit board comprises: an insulating layer part having at least one pair of insulating layers stacked therein; circuit patterns formed on the insulating layers, respectively; and crack preventing parts formed at positions at which they are not interfered by the respective circuit patterns of the insulating layer part and supporting the insulating layer part from external impact.
Inventors:
JUNG JOONG HYUK
YU KWAN SONG
KIM JONG HYUNG
SUNG HOON BAEK
KANG HYEA HYEN
YU KWAN SONG
KIM JONG HYUNG
SUNG HOON BAEK
KANG HYEA HYEN
Application Number:
JP2014029290A
Publication Date:
September 22, 2014
Filing Date:
February 19, 2014
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H05K1/02; H05K3/34
Domestic Patent References:
| JP2009141121A | 2009-06-25 | |||
| JP2006270082A | 2006-10-05 | |||
| JP2004288661A | 2004-10-14 | |||
| JP2012238804A | 2012-12-06 | |||
| JP2012146793A | 2012-08-02 |
Attorney, Agent or Firm:
Koen Kato
Fukukawa 晋矢
Fukukawa 晋矢