PURPOSE: To make it possible to easily recover damages on wiring patterns, or to reduce probability of detects due to wiring discontinuity, considering the possibilities of defects due to wiring discontinuity due to the damage on the wiring patterns caused by the guide of an automatic screw driver device contacting the surface of a printed-circuit board when in its malfunction at the time fixing the printed-circuit board on a chassis with the use of an automatic screw driver device.

CONSTITUTION: Connecting lands 14 are provided for recovering damages on wiring patterns by a wire 19 at the time when the wiring patterns are damaged by a guide 13 of an automatic screw driver device and are broken, or probability of pattern discontinuity is reduced by intentionally increasing the width of the wiring pattern 11 at the position where the guide 13 is likely to cause pattern discontinuity.