Title:
プリント回路板および電子機器
Document Type and Number:
Japanese Patent JP6452270
Kind Code:
B2
Abstract:
A printed circuit board includes a first semiconductor package (1) on a first surface layer (102) of a printed wiring board (101) and a second semiconductor package (2) on a second surface layer (103) where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path (17) from a signal terminal (12) on an inner circumference side of the first semiconductor package via a via hole (16) and the second surface layer to a signal terminal (14) on an outer circumference side of the second semiconductor package and a second bus wiring path (18) from a signal terminal (13) on an outer circumference side of the first semiconductor package via the second surface layer and a via hole (19) to a signal terminal (15) on an inner circumference side of the second semiconductor package are provided, thus securing a return current path and realizing a high density wiring while suppressing radiation noise.
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Inventors:
Hiroshi Isono
Application Number:
JP2012096100A
Publication Date:
January 16, 2019
Filing Date:
April 19, 2012
Export Citation:
Assignee:
Canon Inc
International Classes:
H05K3/46; H01P3/08
Domestic Patent References:
| JP2008109094A | ||||
| JP2000031329A | ||||
| JP2009038112A | ||||
| JP2005191355A | ||||
| JP2010010482A |
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa