Title:
Printed wired board
Document Type and Number:
Japanese Patent JP6029931
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board in which occurrence of open circuit or cracking can be suppressed effectively, even if it is folded with a radius of curvature of 0.5 mm or less.SOLUTION: A printed wiring board used while being folded includes a backing material, a first conductive layer formed on the backing material, a first insulating layer formed on the backing material so as to cover the first conductive layer, and a second conductive layer formed on the first insulating layer. When the Young's modulus of the first insulating layer is Ei1, and the elongation at break of the second conductive layer is Bc2, following formulae (I), (II) are satisfied. 10 MPa
Inventors:
Yasuyuki Tachikawa
Application Number:
JP2012238496A
Publication Date:
November 24, 2016
Filing Date:
October 30, 2012
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
H05K1/02; B32B15/08; H05K3/28; H05K3/46
Domestic Patent References:
| JP2006339186A | ||||
| JP8293213A | ||||
| JP2012067221A | ||||
| JP2011178106A | ||||
| JP2007096131A |
Attorney, Agent or Firm:
Eternal patent business corporation