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Patent Searching and Data


Title:
PRINTED WIRING BOARD, AND DEVICE AND METHOD FOR MANUFACTURING BOARD
Document Type and Number:
Japanese Patent JP2004034193
Kind Code:
A
Abstract:

To faciliate positioning of a printed wiring board when applying a V-cut process to the board.

A printed wiring board manufacturing device is constituted of: a product table 2 on which a printed wiring board 20 is placed; a cutting tooth 12 which forms V cuts 20a on the board through movement of the board; a fixed positioning pin 8 arranged on the product table; a movable positioning pin 11 arranged freely movably in a direction of V-cut forming; a first notched part 21 arranged on one side of the board and to be engaged with the fixed positioning pin 8; and a second notched part 21 arranged on the other side of the board and to be engaged with the movable positioning pin 11. The V cuts are formed in predetermined positions of the board by engaging the fixed and movable positioning pins and the notched parts.


Inventors:
TAKADA SHOSAKU
TAKITA MASAKICHI
Application Number:
JP2002192394A
Publication Date:
February 05, 2004
Filing Date:
July 01, 2002
Export Citation:
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Assignee:
HITACHI COMM TECH LTD
International Classes:
B26D7/01; H05K1/02; H05K3/00; (IPC1-7): B26D7/01; H05K1/02; H05K3/00
Attorney, Agent or Firm:
Teruo Aoki