Title:
PRINTED WIRING BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH04349689
Kind Code:
A
Abstract:
PURPOSE: To provide a low-cost printed board whereby low-impedance patterns of desired characteristics impedance can easily be obtained which design-changes general-purposed patterns into low-impedance patterns, and low-impedance patterns into general-purposed patterns in regard with a printed wiring board having patterns different in characteristics impedance in the same layer and its manufacture.
CONSTITUTION: This printed wiring board has in the same layer an impedance- controlled low-impedance pattern 5 as wide as a general-purposed pattern 2 and thicker as predetermined than the general-purposed pattern 2.
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Inventors:
TOMINAGA JUNJI
SAKAI MIYOSHI
SAKAI MIYOSHI
Application Number:
JP12153091A
Publication Date:
December 04, 1992
Filing Date:
May 28, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01P3/08; H01P11/00; H05K1/02; H05K3/24; H05K1/00; (IPC1-7): H01P3/08; H01P11/00; H05K1/02; H05K3/24
Attorney, Agent or Firm:
Sadaichi Igita