Title:
PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2015028986
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board which incorporates an electronic component and has less warpage.SOLUTION: In a printed wiring board, a first resin insulation layer 30 in which an IC chip 90 is embedded has a heat expansion coefficient higher than that of each of a second resin insulation layer 50A, a third resin insulation layer 50B and a fourth resin insulation layer 50C, which are formed on the first resin insulation layer. Since the first resin insulation layer has a higher heat expansion coefficient, downward warpage of an outer edge side of the first resin insulation layer occurs at high temperature to cancel upward warpage at an outer edge part of each of the second resin insulation layer, the third resin insulation layer and the fourth resin insulation layer, which has the smaller heat expansion coefficient, thereby reducing warpage of the printed wiring board. In addition, since a conductive film is provided on a back face of an electronic component on a sub surface side of the first insulation layer, a difference in conductor area between the sub surface side of the first insulation layer having less conductor area and a conductor area of each of on the second insulation layer, on the third insulation layer and the fourth insulation layer is small thereby, reducing warpage depending on a difference in conductor area.
Inventors:
SHIMIZU KEISUKE
NAKAMURA YUICHI
YAMAGUCHI TAKESHI
NAKAMURA YUICHI
YAMAGUCHI TAKESHI
Application Number:
JP2013157558A
Publication Date:
February 12, 2015
Filing Date:
July 30, 2013
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K3/24
Attorney, Agent or Firm:
Akito Tashimo