Title:
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2016207892
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To maintain adhesion of a wiring conductor layer and a resin insulation layer, while improving the quality of connection with other board, or the like.SOLUTION: In a printed wiring board, a wiring conductor layer is embedded so as to expose the first surface F1 of the wiring conductor layer, and a resin insulation layer 30 is formed to cover the side face of a conductor post 25, and to expose the end face 25a of the conductor post 25. The resin insulation layer 30 contains 70-95 wt% of inorganic filler 31, having a maximum grain size P smaller than 1/3 of the height H1 of the conductor post 25.SELECTED DRAWING: Figure 1B
Inventors:
IKEDA KOSUKE
SAKAI SHUNSUKE
FURUYA TOSHIKI
ADACHI TAKEMA
KATSUNO TAKAYUKI
SAKAI SHUNSUKE
FURUYA TOSHIKI
ADACHI TAKEMA
KATSUNO TAKAYUKI
Application Number:
JP2015089545A
Publication Date:
December 08, 2016
Filing Date:
April 24, 2015
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/38; H05K1/03; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Asahina Patent Office
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