To provide a method of manufacturing a printed wiring board which can be improved in reliability by suppressing the occurrence of defective insulation caused by migration and in which the interval between wiring patterns can be reduced, and to provide a printed wiring board.
The method includes a step of forming an etching resist on the surface of metal foil laminated upon an insulating substrate, a step for forming conductive wiring patterns by removing the unnecessary portion of the metal foil, and a first film forming step of forming first protective films on the side faces of the wiring patterns in a state where the etching resist is left. The method also includes a second film forming step of forming second protective films on at least the upper surfaces of the wiring patterns after the etching resist is removed.
Tomoyasu Sakaguchi
Hiroki Naito