Title:
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016143726
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent cracks from extending into a product area and a product from being failed when cut to a multiple piece printed wiring board from a panel which manufactures a plurality of printed wiring boards in bulk.SOLUTION: A multiple piece printed wiring board 100 includes: a product area 20 composed of a plurality of printed wiring boards; and a dummy area 10 formed around one or two or more product areas 20. On an outer peripheral end edge side of the dummy area 10, a dummy pattern 11 is formed, and a dummy post or a dummy wall 12 is formed while connected only to a part of the dummy pattern 11.SELECTED DRAWING: Figure 1B
Inventors:
SAKAI SHUNSUKE
FURUYA TOSHIKI
NAKAMURA WATARU
ADACHI TAKEMA
FURUYA TOSHIKI
NAKAMURA WATARU
ADACHI TAKEMA
Application Number:
JP2015017472A
Publication Date:
August 08, 2016
Filing Date:
January 30, 2015
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Asahina Patent Office