Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3245692
Kind Code:
B2
Abstract:
PURPOSE: To downsize, to reduce the number of assembly processes and cost, to prevent occurrence of noise and to improve reliability.
CONSTITUTION: An area A where a coil parts M is configured is assured an a portion of multilayer substrate 2, and multiple unit substrates 2a,..., corresponding to the area A are provided with coil patterns 3a, 3b, 3c,..., and the coil patterns 3a,..., of the laminated unit substrates 2a,... are connected through a through hole T,..., so that a coil parts M is constituted. Then, the printed substrate 1 is attracted to another printed substrate for configuration.
Inventors:
Seiichi Yasuzawa
Itoh Hisashi
Itoh Hisashi
Application Number:
JP20184893A
Publication Date:
January 15, 2002
Filing Date:
July 21, 1993
Export Citation:
Assignee:
Nagano Japan Radio Co., Ltd.
International Classes:
H01F17/00; H05K1/16; H05K3/46; (IPC1-7): H05K3/46; H01F17/00; H05K1/16
Domestic Patent References:
| JP6354706A | ||||
| JP1205509A | ||||
| JP4103612U | ||||
| JP660115U | ||||
| JP63157906U |
Attorney, Agent or Firm:
Shigeru Shimoda