PURPOSE: To improve a shield effect without damaging electronic parts to effectively prevent a noise by providing wiring layers connected by a flexible substrate and composed of a plurality of resin plates with metal plates in a printed wiring board so as to dissipate heat generated from the electronic parts via the metal plates.

CONSTITUTION: Resin plates 3, 5 are provided on both sides of a flexible substrate 4, on which wiring layers are formed, and metal plates 2, 6 composed of aluminum are provided outside the resin plates 3, 5. Resin plates 1, 7 are provided outside the metal plates 2, 6; wiring layers are formed on the surfaces of the resin plates; and through holes connected with the wiring layers are provided. Then, protrusions 2a, 6a from the resin plates 1, 3, 5, 7 and flexible substrate 4 are provided at the ends of the metal plates 2, 6 and attached to the case body of an apparatus. Heat generated from mounted electronic parts is dissipated via the metal plates 2, 6 and the case body so that the temperature of the electronic parts is lowered and the electronic parts are prevented from being damaged.