Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH10190174
Kind Code:
A
Abstract:
To provide a printed wiring board high in heat-resistant characteristics and electric insulation reliability under moisture absorption.
A base material composed of the entire aromatic polyester fiber and resin are compounded to forme an insulation layer. An electric circuit is provided in an insulation layer and a conductor electrically connecting with the electric circuit is formed in the insulating layer. The insulation layer is formed using the base material compose of the entire aromatic polyester fiber small in coefficient of moisture absorption, then it is possible to increase moisture absorption insulation and moisture absorption heat-resistance of the insulation layer.
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Inventors:
FUJIKI TOMOYUKI
MISAWA HIDETO
ITO KOICHI
MISAWA HIDETO
ITO KOICHI
Application Number:
JP34420496A
Publication Date:
July 21, 1998
Filing Date:
December 24, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B27/00; B32B27/36; H05K1/03; H05K1/11; (IPC1-7): H05K1/03; B32B27/00; B32B27/36; H05K1/11
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)
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