Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH1075032
Kind Code:
A
Abstract:
To provide a printed wiring board which can improve solderability of an electronic component having hook leads, and enlarged conductor pattern area.
A printed wiring board has a through-hole 22 to pass hook leads 20 of a connector through. The through hole 22 is formed in a narrow and long shape in cross section, and its width is set slightly larger than the thickness of the hook leads 20. At both ends in the longitudinal direction of the periphery of an opening of the through-hole 22, pad sections 14a, 14b are formed for soldering the hook leads 20.
Inventors:
HATAKEYAMA HIDETOSHI
Application Number:
JP22826496A
Publication Date:
March 17, 1998
Filing Date:
August 29, 1996
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K1/18; H05K1/11; H05K3/30; H05K3/34; (IPC1-7): H05K1/18
Attorney, Agent or Firm:
Takehiko Suzue (6 outside)