Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPS6418297
Kind Code:
A
Abstract:
PURPOSE: To reduce the thermal loads received by surface-mountable components which are sensitive to heat when the components are soldered by constituting the components so that the components can be inserted into the notch of a printed wiring board. CONSTITUTION: A notch 19 for inserting surface-mountable components 7 is provided on a printed wiring board and the size of the notch 19 is nearly matched to the size of the bottom face of the components 7. On the side walls 5 of the notch 19, bonding elements 22 are provided to electrically connect printed conductors 23 to the electrical terminals 6 and 18 of the components 7. Therefore, when the components 7 are soldered in a solder bath, the components 7 can be positioned in such a state that the wave of a solder flow only comes into contact with contact pins or the bottom face of the components 7. As a result, only a small heat load is generated even when the entire body of the components 7 is led over the wave of the solder flow.
Inventors:
HENNERU KUNIRIMU
PEETERU FUERUZEN
PEETERU FUERUZEN
Application Number:
JP14492288A
Publication Date:
January 23, 1989
Filing Date:
June 14, 1988
Export Citation:
Assignee:
WABCO WESTINGHOUSE FAHRZEUG
International Classes:
H05K1/18; H05K3/00; H05K3/34; H05K3/40; (IPC1-7): H05K1/18; H05K3/00
Attorney, Agent or Firm:
Osamu Nakahira