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Title:
PRINTER, PRINTING METHOD, AND MANUFACTURING METHOD OF MOUNTING BOARD
Document Type and Number:
Japanese Patent JP2023077440
Kind Code:
A
Abstract:
To provide a printer capable of manufacturing a mounting board having bumps of high quality, a printing method, and a manufacturing method of the mounting board.SOLUTION: A printer includes: a board holding part 30 for holding a board B1 whose top face is provided with a thin film G1 having a plurality of first openings H1, and in which a plurality of electrodes E1 are exposed from the plurality of first openings H1; a rear side exhaust part 61R for exhausting gas inside the plurality of first openings H1; a filling part 60 for filling, with a paste Pst, the plurality of first openings H1 from which the gas is exhausted; a print head moving relative to the board B1 on the held board B1; and an oscillator 31 for imparting oscillation to at least the held board B1.SELECTED DRAWING: Figure 20

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Inventors:
TANAKA TETSUYA
Application Number:
JP2021190672A
Publication Date:
June 06, 2023
Filing Date:
November 25, 2021
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
B41F15/08; B41M1/12; H05K3/34
Attorney, Agent or Firm:
Kenji Kamada
Kenji Maeda



 
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