Title:
PRINTING DEVICE AND SOLDER DROP-WIDTH CONTROL METHOD
Document Type and Number:
Japanese Patent JP2023073571
Kind Code:
A
Abstract:
To enable a scraper to drop solder on a mask, into an appropriate roll shape.SOLUTION: A width Wa of solder S on a mask M is obtained before the solder is scooped up (a step S104), and a width Wb of the solder S on the mask M is obtained after the solder is dropped down (a step S106). A main control part 110 calculates a correction value Vtb (n+1) of a speed Vtb at which a sheet T on an upper surface 813 of a scraper 81 is moved to one side X1 by dropping-down the solder, on the basis of the width Wa and the width Wb (a step S108). When dropping-down of the solder is executed after the correction value is calculated, a speed Vsb of the scraper 81 and the speed Vtb of the sheet T are controlled, with the speed Vtb corrected on the basis of the correction value.SELECTED DRAWING: Figure 4
Inventors:
MIWA TAKESHI
Application Number:
JP2021186108A
Publication Date:
May 26, 2023
Filing Date:
November 16, 2021
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD
International Classes:
B41F15/40; B41F15/08; B41F15/42; H05K3/34
Attorney, Agent or Firm:
Shoichi Swing
Kazumasa Ohnishi
Kazumasa Ohnishi