PURPOSE: To devise the title printing method wherein the surface of an electrode bump is spread with an anisotropic resin in even thickness with conductive particles properly scattered in said resin.
CONSTITUTION: The screen fixing bumps 13 higher than electrode bumps 3 are formed on a conductive pattern 2 outside the plane projection configuration of a semiconductor device 4 to be mounted so that a screen plane may be placed on the fixing bump in parallel with and in contact with the screen plate and then the opening part 11 of the screen plate may be aligned with the position of the semiconductor device 4. Later, an anisotropic conductive resin 6 is spread on the screen plate to be moved at specific rate by applying a specific pressure on a squeegee 12 so that the anisotropic conductive resin 6 may be squeezed out of the opening part 11 to perform the printing step.
HASHIZUME JIRO
KUZUHARA KAZUNARI
