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Patent Searching and Data


Title:
PROBE AND PROBE ASSEMBLY
Document Type and Number:
Japanese Patent JP2005077410
Kind Code:
A
Abstract:

To provide a direct coupling type non-resonant probe for measuring a pressure, in which occurrence of resonant pressure waves which degrade precision is reduced and measurement is possible is possible especially in a high temperature environment.

There are provided a first pipe 2 comprising a first end and a second end arranged at a measurement position 1, a second pipe 5 comprising the first end and the second end, a connector 3 which connects the second end of the first pipe 2 to the second end of pipe 5, and comprises a converter 13; and a termination element 11 connected to the first end of the second pipe 5. The second pipe 5 has a sufficient length for substantially eliminating resonance.


Inventors:
CHOWDHURY SUBHRADEEP
Application Number:
JP2004246097A
Publication Date:
March 24, 2005
Filing Date:
August 26, 2004
Export Citation:
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Assignee:
UNITED TECHNOLOGIES CORP
International Classes:
F01D17/08; F01D21/00; G01L7/00; G01L19/00; G01L19/06; G01L23/00; (IPC1-7): G01L19/00; G01L19/06; G01L23/00
Domestic Patent References:
JPS55116237A1980-09-06
JPH06331146A1994-11-29
JPH11125573A1999-05-11
JP2000510239A2000-08-08
Attorney, Agent or Firm:
Tsuyoshi Hashimoto
Tomioka Kiyoshi