Title:
プローブカード・アセンブリ及びキット、及びそれらを用いる方法
Document Type and Number:
Japanese Patent JP4588721
Kind Code:
B2
Abstract:
The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.
Inventors:
Handross, igo, wai
Matthew, Gaetan, El
Eldridge, Benjamin, N
Group, gary, dw
Matthew, Gaetan, El
Eldridge, Benjamin, N
Group, gary, dw
Application Number:
JP2007000149A
Publication Date:
December 01, 2010
Filing Date:
January 04, 2007
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
G01R1/073; B23K1/00; B23K20/00; B23K31/02; C23C18/16; C25D5/16; C25D7/12; G01R1/04; G01R1/06; G01R1/067; G01R31/26; G01R31/28; H01L21/00; H01L21/48; H01L21/56; H01L21/58; H01L21/60; H01L21/603; H01L21/607; H01L21/66; H01L21/68; H01L23/02; H01L23/12; H01L23/32; H01L23/48; H01L23/485; H01L23/49; H01L23/498; H01L23/538; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H01R9/00; H01R12/16; H01R12/71; H01R13/05; H01R13/24; H01R29/00; H01R33/74; H01R33/76; H05H1/18; H05K1/18; H05K3/24; H05K3/30; H05K3/32; H05K3/40; H05K7/10; C25D5/08; C25D5/22; C25D21/02; H01R107/00; H05K1/14; H05K3/20; H05K3/34; H05K3/36
Domestic Patent References:
| JP6265577A | ||||
| JP4320044A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Katsuro Tanaka
Shinji Oga
Katsuro Tanaka
Shinji Oga