Title:
プローブカードアセンブリ
Document Type and Number:
Japanese Patent JP5466007
Kind Code:
B2
Abstract:
Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.
Inventors:
Eldridge, Benjamin N.
Glitters, John K.
Martens, Rodney Eye.
Slocom, Alexander H.
Yaguri Ogur, Onic
Glitters, John K.
Martens, Rodney Eye.
Slocom, Alexander H.
Yaguri Ogur, Onic
Application Number:
JP2009533469A
Publication Date:
April 09, 2014
Filing Date:
October 15, 2007
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
B82B1/00; G01R1/067; B82B3/00; G01R1/073; G01R31/28; H01R13/24; H01R33/74; H01R33/76; C01B31/02
Domestic Patent References:
| JP2000516708A | ||||
| JP2003284304A | ||||
| JP2006177759A |
Foreign References:
| US20040106218 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
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