Title:
PROBE DEVICE AND ITS ASSEMBLING METHOD
Document Type and Number:
Japanese Patent JP3538696
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate and simplify the assembly of a probe device including a fine adjustment process of a probe tip.
SOLUTION: In this assembling method, a contact probe 1 is mounted on a mounting base 36, and then installed on a fine adjustment mechanism in the state of a first unit 32 formed by mounting the probe 1 on a base clamp 33, and position adjustment is executed so that contact pins 2a... will coincide with pad arrangement of an IC chip 18. Thereafter, a second unit is fitted to the first unit. Namely, the base clamp 33 is connected to a printed board 38 through a top clamp 40. The base part 1b of the contact probe 1 is connected and fixed to the printed board 38 with a bottom clamp.
Inventors:
Sugiyama, Tatsuo
Yoshida, Hideaki
Tachikawa, Nobuyoshi
Iwamoto, Takafumi
Matsuda, Atsushi
Yoshida, Hideaki
Tachikawa, Nobuyoshi
Iwamoto, Takafumi
Matsuda, Atsushi
Application Number:
JP23471098A
Publication Date:
June 14, 2004
Filing Date:
August 20, 1998
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
G01R1/073; G01R31/28; H01L21/66; H01L23/32; H01R33/76; (IPC1-7): G01R1/073; G01R31/28; H01L21/66; H01L23/32; H01R33/76