To obtain a probe needle that is capable of probing accurately, has a simple structure, and can be easily manufactured by performing the probing to a probe pad at a fixed needle side and preventing it from being made at a movable needle side.

When a pressure is applied to a guide plate 7, a probe needle 11 is lowered against the resilient force of an elastic material 8 and contacts the lead wire of a semiconductor element 22 and a probe pad on a printed circuit board 21. At this stage, the probe needle 11 rises along with an outer cylinder, so that no load is applied to the printed circuit board 21. Further, when a pressure continues to be applied to the guide plate 7, the upper edge of the probe needle 11 contacts the probe pad being provided at the guide plate 7 and is loaded, a movable needle retreats, and a load is applied onto the printed circuit board 21. Therefore, the probe needle 11 does not apply a load to, for example, the lead wire of a semiconductor element 22 on the printed circuit board 21 when a pressure starts to be applied to the guide plate 7 and can be brought into contact with, for example, the lead wire with an improved balance, thus achieving an inspection accurately.