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Title:
PROBE STRUCTURE HAVING BUMP WITH FILLER THEREIN
Document Type and Number:
Japanese Patent JPH06347482
Kind Code:
A
Abstract:

PURPOSE: To provide a probe structure which can suppress the abrasion of a bump surface in a severe operational condition, and thereby has an excellent durability, in a probe structure which has a test head with bump.

CONSTITUTION: This probe structure has a structure to connect a lead 1 provided on one side surface of an insulating film 2, and a bump 7 consisting of a metallic material provided on the other side surface of the film 2, and has a test head in which at least a contact with an object to test in the bump 7 consists of a metallic material and a composite including an antiabrasive fine particle or fiber. As a result, an abrasion on the bump surface owing to the contact of the bump 7 and a circuit base 6 or the like is suppressed, and the probe structure having a durable metallic bump, and thereby a durable test head, can be obtained.


Inventors:
BABA TOSHIKAZU
AMINO ICHIRO
YADA HIROSHI
NAITO TOSHIKI
Application Number:
JP14045593A
Publication Date:
December 22, 1994
Filing Date:
June 11, 1993
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G01R1/073; H01L21/66; (IPC1-7): G01R1/073; H01L21/66
Attorney, Agent or Firm:
Takashima Hajime



 
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