Title:
超音波診断装置用プローブ及びその製造方法
Document Type and Number:
Japanese Patent JP5828627
Kind Code:
B2
Abstract:
A probe (100) for an ultrasonic diagnostic apparatus and a method of manufacturing the same are disclosed. The probe (100) includes a sound matching layer (130) having a mounting groove (135), a piezoelectric member (120) mounted on the mounting groove (135), a first connector (140) interconnected to the sound matching layer (130), and a second connector (150) interconnected to the piezoelectric member (120). The probe (100) permits interconnection of the piezoelectric member (120) to the first and second connectors to be performed rapidly and easily through a single bonding operation, thereby reducing manufacturing time while facilitating the manufacture of the probe.
Inventors:
Lee, Song Jae
Park, John Lim
Kim, Jake
Park, John Lim
Kim, Jake
Application Number:
JP2010229963A
Publication Date:
December 09, 2015
Filing Date:
October 12, 2010
Export Citation:
Assignee:
SAMSUNG MEDISON CO.,LTD.
International Classes:
H04R17/00; A61B8/00; G01N29/24; H04R31/00
Domestic Patent References:
| JP2003244793A | ||||
| JP2009177342A | ||||
| JP2002247696A | ||||
| JP4336799A | ||||
| JP4347146A |
Attorney, Agent or Firm:
Takeshi Ebe
Kazuo Asahi
Kazuo Asahi