Title:
PROCESS FOR BONDING
Document Type and Number:
Japanese Patent JPS52102349
Kind Code:
A
Abstract:
PURPOSE: A process for bonding characterized by the improved adhesion between metal and resin employes the composition based on the cross-linked nylon retaining the autohesion.
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Inventors:
HIROSE TOSHIROU
KOIDE MASAKI
MATSUBARA TAKASHI
KURODA YUUSUKE
KOIDE MASAKI
MATSUBARA TAKASHI
KURODA YUUSUKE
Application Number:
JP1848476A
Publication Date:
August 27, 1977
Filing Date:
February 24, 1976
Export Citation:
Assignee:
TOA GOSEI CHEM IND
International Classes:
C09J5/00; C08L77/00; C09J177/00; (IPC1-7): C08L77/00; C09J3/00