PROCESS OF DEPOSITING METALLIC LAYER FREE OF NICKEL AND CHROMIUM (VI)

Title:

PROCESS OF DEPOSITING METALLIC LAYER FREE OF NICKEL AND CHROMIUM (VI)

Document Type and Number:

Japanese Patent JP2005154902

Kind Code:

A

Abstract:

To deposit a mat metallic layer free of nickel and chromium.

For coating a substrate with a first mat metallic layer, and obtaining a coated-substrate having a matting-treated surface, the first mat metallic layer is metallized with a second metallic layer which partakes of the mat effect of the first metallic layer. The first mat metallic layer does not comprise nickel, and the second metallic layer does not comprise nickel and chromium (VI). Metal for producing the first mat metallic layer is at least one metal among copper, silver, tin, zinc and alloys comprising no nickel, and metal for producing the second metallic layer is at least one metal among copper, tin, zinc, chromium (III), silver, gold, ruthenium, platinum, palladium and their alloys.

Inventors:

MOBIUS ANDREAS
BRECHT JOACHIM
PIES PETER
SCHAAF HANS-PAUL

Application Number:

JP2004335226A

Publication Date:

June 16, 2005

Filing Date:

November 19, 2004

Export Citation:

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Assignee:

ENTHONE

International Classes:

C09D1/00; C23C18/16; C23C18/31; C23C28/00; C23C28/02; C23C30/00; C25D3/02; C25D3/56; C25D5/10; C25D5/12; C25D7/00; (IPC1-7): C25D5/10; C23C28/00; C25D5/12; C25D7/00

Domestic Patent References:

JPH08134689A	1996-05-28
JPH0247285A	1990-02-16
JP2003073886A	2003-03-12
JP2003268568A	2003-09-25
JP2001271198A	2001-10-02
JP2003239083A	2003-08-27

Attorney, Agent or Firm:

Hironobu Onda
Makoto Onda

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