Title:
基板の化学的及び／又は電解的表面処理用プロセス流体の分布システム
Document Type and Number:
Japanese Patent JP7250999
Kind Code:
B2
Abstract:
The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the distribution system, and a manufacturing method for a distribution system for a process fluid configured for chemical and/or electrolytic surface treatment of a substrate.The distribution system for a process fluid configured for chemical and/or electrolytic surface treatment of a substrate comprises: a first distribution body, a substitute body, and a framework. The first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution body and the substitute body are arranged to insert the substrate between them. The framework is configured to mount the first distribution body and the substitute body relative to each other. The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate which is sealed in order to avoid stray currents.
More Like This:
Inventors:
Andreas Gleissner
Harald Medol
Harald Medol
Application Number:
JP2022516436A
Publication Date:
April 03, 2023
Filing Date:
November 16, 2020
Export Citation:
Assignee:
SEMSYSCO GmbH
International Classes:
H05K3/18; C25D17/10; C25D21/12
Domestic Patent References:
| JP2002173793A | ||||
| JP6277495A | ||||
| JP537543A | ||||
| JP201311004A | ||||
| JP201949046A | ||||
| JP201952370A |
Foreign References:
| US20150129418 | ||||
| CN203238341U | ||||
| CN104790022A | ||||
| CN205774869U | ||||
| CN207973814U |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Emi Kimitsuka
Mitsutsugu Sugimura
Emi Kimitsuka